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Product examples |
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Features |
Optimum heat dissipation and insulation structure
- ・The resin substrate, developed by our own technology, incorporates high thermal conductive insulating resin formed on the base plate (aluminum plate).
- ・Guarantees insulation resistance for high power parts (reinforced insulation).
- ・A lead frame (copper plate electrode) with a thickness of millimeter order can be formed.
- ・The resin is UL certified material (color: black, thickness: 0.4 to 1.6 mm).
- ・Thermal conductivity of resin (3.4 W/m·K)
- ・Planar conduction radiation effect
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Construction |
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Labor-saving effect |
Small, thin, high efficiency, quiet
- ・Heat dissipation efficiency to the equipment cabinet is improved, allowing elimination of fan and heat sink.
- ・Because the electrode thickness is large, it can support large electric power and is very excellent in terms of in-plane uniformity.
- ・Contributing to energy conservation by increasing efficiency through minimizing wiring of modularized parts
- ・The end part of lead frame (copper plate electrode) can be formed to the input/output terminals, simplifying the structure of connection reliability.
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Uses |
- ・General sealed type power supply, charger, uses for base stations and medical equipment, etc.
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